X-ray Computed Tomography Flaw Phantom Development: Stepper Photolithography and Deep Reactive Ion Etching

X-ray computed tomography (XCT) is a powerful tool for detecting flaws in advanced manufacturing. This study from NIST explores new methods to create precise defect artifacts using stepper photolithography and deep reactive ion etching. By simulating flaws with high accuracy, researchers aim to improve XCT’s ability to detect microscopic defects in materials. These advancements will support quality control in industries like additive manufacturing and semiconductor fabrication.